Complete precision machining solutions for semiconductor and hard brittle material manufacturing.
From patented both-side micro drilling to diamond wire sawing, precision grinding, step polishing, and nano imprinting — a complete solution for silicon, SiC, AlN, quartz, and advanced ceramic semiconductor components.
Patented simultaneous dual-spindle micro hole drilling. Concentricity ≤20㎛, L/D 30, 2-3× throughput.
En savoir plus →Diamond wire batch slicing for Si, SiC, Sapphire, NdFeB. Proprietary tilting/rotating technology.
En savoir plus →Freely adjustable thickness. Ideal for R&D and precision small-batch cutting.
En savoir plus →Multi-axis CNC grinding for surface, ID, and OD in a single setup.
En savoir plus →Cylindrical coring of Si, SiC, Sapphire ingots. Chipping-free entry/exit.
En savoir plus →Mirror-finish polishing for step, groove, and inclined surfaces. Ra < 1nm.
En savoir plus →Vertical-axis face grinding for large-diameter flat workpieces. Flatness < 1μm.
En savoir plus →UV/thermal nano-imprint lithography. Sub-100nm patterning for Nano-LED and semiconductor.
En savoir plus →Contact us for technical specifications, machining test requests, or a custom quote.
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