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MACHINES

Both-Side Drilling Machine

ANT-BSSD500

ANT-BSSD500

Both-Side Drilling Machine

The world's first simultaneous dual-spindle micro hole drilling machine. Two spindles drill from both faces at once — eliminating the workpiece reversal that causes concentricity defects in conventional drilling.

  • 01Both-side simultaneous drilling — concentricity within 20㎛
  • 02Horizontal structure — natural chip evacuation, L/D 30
  • 032~3× throughput vs vertical type — extended unattended run time
≤ 20 ㎛Concentricity
L/D 30Max Aspect Ratio
Ø 0.30 mmMin Diameter
◈Korean Patent No. 10-1579164
PRODUCT VIDEO

Introducing ANT-BSSD500

ANT-BSSD500 Production Line
PRODUCTION FACILITY

Manufactured In-House at Our Changwon Factory

Multiple ANT-BSSD500 units in active production. Each machine is designed, manufactured, assembled, and tested at our headquarters — no outsourcing at any stage. The engineering team that designs your machine is the same team that supports you after delivery.

Precision Machining Floor
QUALITY CONTROL

Full Production, Testing, and QC Under One Roof

From raw casting to final calibration — every step happens in our facility. Precision machining, electrical assembly, CNC controller integration, spindle alignment, and full functional testing are completed before any machine leaves the factory.

DIFFERENTIATION

Two Engineering Innovations That Redefine Hole Drilling

Both-side simultaneous drilling and a horizontal architecture lift quality, machinability, and throughput at the same time.

01

Both-Side Simultaneous Drilling

Eliminates the workpiece-flip step — the largest source of concentricity error in conventional drilling.

BEFORE

Single-Direction Type

  • Drill one face, then flip and re-fixture for a 2-step process
  • Pitch error and concentricity defects introduced during the flip
  • Total cycle time grows; operator intervention raises labor cost
  • Alignment error reduces yield
→
AFTER

Both-Side Type

  • Two spindles drill simultaneously from both faces — no flip required
  • Concentricity held within 20㎛ at all times
  • Hole quality preserved even when machine pitch error occurs
  • Longer unattended runs — higher yield, more output
02

Horizontal Machining Structure

A horizontal hole axis lets chips evacuate naturally — the key enabler for true deep-hole drilling.

BEFORE

Vertical Type

  • Gravity packs swarf inside the hole
  • Reduced coolant flow — risk of drill breakage
  • Hard ceiling on deep-hole capability
→
AFTER

Horizontal Type

  • Chips evacuate horizontally by gravity — drill protected
  • 1.5–2× throughput at identical cutting conditions
  • 2–3× throughput with optimized recipe
ANT-BSSD500 Close-Up
PRECISION IN EVERY DETAIL

Designed, Manufactured, and Tested In-House

Every ANT-BSSD500 is built entirely at our Changwon headquarters — from mechanical design and control system integration to final assembly, calibration, and quality testing.

MATERIAL

What Materials Can Be Machined?

Specialized for hole drilling in brittle hard materials with hardness above 1,000 Hv.
Diamond tool-based precision machining minimizes chipping and micro-cracks.

Si

Monocrystalline Silicon

Single Crystal Silicon

Hardness ~1,200 Hv
AlN

Aluminum Nitride

ESC & Heater Substrate

ESC · Heater Material
SiO₂

Fused Silica / Quartz

Chamber Components

Hardness ~1,100 Hv

Also compatible with: Polycrystalline Si · SiC · Alumina Ceramic · Graphite · Sapphire

APPLICATION

Which Semiconductor Components Require Hole Drilling?

Consumable parts in dry-etch, CVD, and ALD chambers carry hundreds to thousands of precision holes. ANT-BSSD500 is engineered for exactly this micro-hole work.

CORE

Silicon Electrode

SILICON ELECTRODE

Plasma-generation electrode in dry-etch chambers. Hundreds to thousands of through-holes machined from both faces.

CORE

Shower Head

SHOWER HEAD

CVD/ALD chamber gas-distribution component. Requires high-precision hole arrays for uniform flow.

CORE VALUE

Three Measurable Outcomes From One Patent

Both-side simultaneous drilling and the horizontal structure are protected by Saehan Nanotech's patent — translating directly into quality, machinability, and productivity gains.

01 / QUALITY
0㎛
Hole-to-hole concentricity
Quality
PRECISION
  • Concentricity held within 20㎛ across the workpiece
  • Workpiece flip step removed — error source eliminated at root
  • Hole quality preserved even under machine pitch error
02 / MACHINABILITY
0L/D
Maximum aspect ratio
Machinability
DEEP-HOLE
  • Dedicated deep-hole drilling design — Ø0.35 mm and up validated
  • Hole-life testing completed across drill diameters — reliability proven
  • Aspect ratio L/D up to 30 tested in production
03 / PRODUCTIVITY
0×
Throughput vs. vertical type (optimized)
Productivity
THROUGHPUT
  • 1.5–2× throughput at identical cutting conditions
  • 2–3× throughput with optimized horizontal-concept recipe
  • Longer unattended runtime — direct labor-cost reduction
SPECIFICATIONS

Technical Specs

Korean Patent No. 10-1579164. Standard specifications — custom design available.

Machine Capacity
Max Stroke (X, Y, Z1, Z2 Axis)480 × 480 × 140 × 140 mm
Max Speed — X, Y Axis6 m/min
Max Speed — Z1, Z2 Axis8 m/min
Work SizeMax Ø400 mm, Max t 20.0 mm
Feed Unit
Z1, Z2 Axis Motor1.4 kW AC Servo Motor
X, Y Axis Motor2 kW AC Servo Motor (Brake)
Spindle Unit (FISCHER, Germany)
R.P.M.4,000 ~ 25,000 RPM
Tool HolderHSK-E25
Output Power1 kW
Drill Diameter Range (PCD)Min Ø0.30 mm ~ Max Ø3.0 mm
Tool ChangeShank — Manual Change
Coolant
Tank · Pump220 ℓ, 30 ℓ/min
Spindle Coolant Unit2,500 kcal
Controller
CNC ControllerFANUC-OiMF-PLUS
Utility
Main Power220 V ± 10 V
Air (Dry Clean Air)5 ± 0.5 bar, 120 ℓ/min
Room Temperature22 ~ 26 °C / Humidity ≤ 60%
Footprint
Machine Size (W × L × H)1,900 × 2,900 × 2,700 mm
Installation Space3,200 × 4,200 × 3,000 mm
Weight6,200 kg

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